Dejin Computer Technology
Electronics Design & Manufacture
Projects Printed Circuit Board (PCB) Fabrication Projects: Material: FR4 (+RCC) Layers: 10 Layers Thickness: 1.6mm Min Trace Width/Clearence: 0.075mm Min Via diamension: 0.125mm Surface Finished: Immersion Gold Material: Taconic-RF35 Layers: 2 Layers Thickness: 0.75mm DK Value: 3.5 DF Value: 0.0025 Surface Finished: HASL (Lead free) Material: Taconic-RF35 Layers: 8 Layers Thickness: 2mm Differential Impedance Control: 90/100/110 ohm Surface Finished: HASL (Lead free) Printed Circuit Board Assembly (PCBA) Component Installation SMT & DIP: Industrial/Mechanical Design Project: Speaker Industrial/Mechanical Design from Customer Dedicated Requirement Customized Design Electronics Muscial Instrument Wireless Power Transmitting |